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    Applications

    ESI’s ACE+ Suite is used by a highly diverse set of industries to solve complex simulation and modeling challenges across a wide spectrum of applications. ESI developed these tools in direct response to the marketplace’s need for real engineering solutions to improve and accelerate the product development process.

    While ESI serves “classical” CFD markets such as the ground vehicle and aerospace industries, ESI's powerful, comprehensive multiphysics capabilities also solve the most challenging problems in industries as diverse as semiconductor, fuel cells, plasma, biomedical, MEMS, and microfluidics, among many others.

    These industries often require simulation and modeling solutions that are much more than just flow and heat transfer.  ESI’s one simulation code CFD-ACE+ can simulate flow, heat transfer, and both gas phase and surface reaction chemical reactions all in one simulation, thereby addressing a common challenge faced by the semiconductor industry.   The application of a single simulation code can also be applied in the MEMS and microfluidics to address the need to couple flow and stress to solve a fluid-structural-interaction (FSI) problem.

    ESI implicitly helps users solve complex simulation and modeling challenges with one tool which typically eliminates the need to explicitly link several tools.  The benefits to the user are clear:  ESI’s powerful, single solution for complex modeling and simulation challenges over a wide spectrum of industries saves time and money, letting you get your product designed and developed accurately and quickly, and ultimately, faster to market.

    • Aerospace Applications
    • Automotive Applications
    • Biomedical Applications
    • Fuel Cell Applications
    • MEMS Applications
    • Microfluidics Applications
    • Plasma Applications
    • Semiconductor Processing

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    Page URL:
    https://cn.esi-group.com/software-solutions/virtual-environment/cfd-multiphysics/applications
    Permanent link to the page:
    https://cn.esi-group.com/node/1569
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